Optical transmission module

ABSTRACT

An optical transmission module includes: a main substrate having a front surface and a back surface; an optical connector having a connector substrate; a first transparent substrate disposed between the connector substrate and the main substrate; a heat source element disposed between the connector substrate and the back surface of the main substrate, and electrically connected to the main substrate; one or a plurality of wirings electrically connecting the heat source element to the main substrate, and each configured to transfer heat generated from the heat source element and the first transparent substrate, to the main substrate; a first special region preventing the heat generated from the heat source element and the first transparent substrate, from being transferred to the connector substrate; and a second special region providing a function of transferring the heat generated from the heat source element and the first transparent substrate.

CROSS REFERENCE TO RELATED APPLICATIONS

This Application is a Continuation Application of application Ser. No.16/353,671, filed Mar. 14, 2019 which is a Continuation of applicationSer. No. 15/879,235, filed Jan. 24, 2018 which is a ContinuationApplication of application Ser. No. 14/475,702, filed Sep. 3, 2014 andissued as U.S. Pat. No. 9,893,815 on Feb. 13, 2018, which claims thebenefit of Japanese Priority Patent Application JP 2013-194048 filedSep. 19, 2013, the entire contents of these applications areincorporated herein by reference.

BACKGROUND

The present disclosure relates to an optical transmission module usedfor transmission of light.

An optical transmission module with insertable and removable opticalconnector typically has a configuration in which an optical connector isdisposed on a main substrate mounted with an optical element and a drivecircuit (see Japanese Unexamined Patent Application Publication Nos.2007-249194, 2004-240220, and 2005-252041).

SUMMARY

However, the optical element and the drive circuit become hightemperature, and therefore heat radiated therefrom deforms a vulnerableoptical connector, which may accordingly deteriorate optical couplingefficiency between the optical element and the optical connector.

In the configuration described in Japanese Unexamined Patent ApplicationPublication No. 2007-249194, an optical element and a drive element areenclosed by a flexible board to be contained in a housing. In thisconfiguration, since an optical connector is directly fixed to thehousing containing a heat source, there is a high possibility thatoptical coupling efficiency is deteriorated due to thermal deformation.

The invention described in Japanese Unexamined Patent ApplicationPublication No. 2004-240220 is mainly to perform positioning of anoptical connector with high accuracy, and has no regard for enhancingheat radiation property. Therefore, heat of a drive element is directlytransferred to the optical connector, which may cause deterioration inoptical coupling efficiency due to thermal deformation.

In Japanese Unexamined Patent Application Publication No. 2005-252041,although the description is made of heat radiation, there is room forimprovement in heat radiation property. In particular, the heatradiation effect is described (incorrectly) oppositely to the intentionof the present disclosure. For example, in a paragraph [0030] ofJapanese Unexamined Patent Application Publication No. 2005-252041,there is description that the heat source element is made not in contactwith a main substrate, which makes it possible to radiate heat moreeffectively. However, when the heat source element is not in contactwith the main substrate, the heat radiation property is extremely low.

It is desirable to provide an optical transmission module capable ofsuppressing deformation by heat and deterioration in optical couplingefficiency.

According to an embodiment of the disclosure, there is provided anoptical transmission module including: a main substrate having a frontsurface and a back surface; an optical connector having a connectorsubstrate; a first transparent substrate disposed between the connectorsubstrate and the main substrate; a heat source element disposed betweenthe connector substrate and the back surface of the main substrate, andelectrically connected to the main substrate; one or a plurality ofwirings electrically connecting the heat source element to the mainsubstrate, and each configured to transfer heat generated from the heatsource element and the first transparent substrate, to the mainsubstrate; a first special region provided between the connectorsubstrate and the first transparent substrate to prevent the heatgenerated from the heat source element and the first transparentsubstrate, from being transferred to the connector substrate; and asecond special region provided between the heat source element and theback surface of the main substrate to provide a function of transferringthe heat generated from the heat source element and the firsttransparent substrate.

In the optical transmission module according to the embodiment of thedisclosure, transfer of the heat generated by the heat source elementand the first transparent substrate is suppressed in the first specialregion formed between the connector substrate and the first transparentsubstrate. It becomes possible to provide the function of transferringthe heat generated by the heat source element and the first transparentsubstrate in the second special region formed between the heat sourceelement and the back surface of the main substrate.

In the optical transmission module according to the embodiment of thedisclosure, the first special region to suppress transfer of the heatand the second special region to provide the function of transferringthe heat are provided. Therefore, it is possible to suppress deformationby the heat and deterioration in optical coupling efficiency between theconnector substrate and the first transparent substrate.

Note that, the effects described here are not necessarily limited, andany of effects described in the present disclosure may be obtained.

It is to be understood that both the foregoing general description andthe following detailed description are exemplary, and are intended toprovide further explanation of the technology as claimed.

BRIEF DESCRIPTION OF THE DRAWINGS

The accompanying drawings are included to provide a furtherunderstanding of the disclosure, and are incorporated in and constitutea part of this specification. The drawings illustrate embodiments and,together with the specification, serve to explain the principles of thetechnology.

FIG. 1 is a sectional diagram illustrating a configuration example of anoptical transmission module according to a first embodiment of thedisclosure.

FIG. 2 is a sectional diagram illustrating a configuration example of anoptical transmission module according to a first modification of thefirst embodiment.

FIG. 3 is a sectional diagram illustrating a configuration example of anoptical transmission module according to a second modification of thefirst embodiment.

FIG. 4 is a sectional diagram illustrating a configuration example of anoptical transmission module according to a third modification of thefirst embodiment.

FIG. 5 is a sectional diagram illustrating a configuration example of anoptical transmission module according to a second embodiment.

FIG. 6 is a sectional diagram illustrating a configuration example of anoptical transmission module according to a third embodiment.

FIG. 7 is a sectional diagram illustrating a configuration example of anoptical transmission module according to a fourth embodiment.

FIG. 8 is a sectional diagram illustrating a configuration example of anoptical transmission module according to a fifth embodiment.

FIG. 9 is a sectional diagram illustrating a first configuration exampleof an optical transmission module according to a sixth embodiment.

FIG. 10 is a sectional diagram illustrating a second configurationexample of the optical transmission module according to the sixthembodiment.

FIG. 11 is a sectional diagram illustrating a third configurationexample of the optical transmission module according to the sixthembodiment.

FIG. 12 is a sectional diagram illustrating a first configurationexample of an optical transmission module according to a seventhembodiment.

FIG. 13 is a sectional diagram illustrating a second configurationexample of the optical transmission module according to the seventhembodiment.

FIG. 14 is a sectional diagram illustrating a configuration example ofan optical transmission module according to an eighth embodiment.

FIG. 15 is a sectional diagram illustrating a configuration example ofan optical transmission module according to a ninth embodiment.

FIG. 16 is a sectional diagram illustrating a configuration example ofan optical transmission module according to a tenth embodiment.

FIG. 17 is a sectional diagram illustrating a configuration example ofan optical transmission module according to an eleventh embodiment.

FIG. 18 is a sectional diagram illustrating a configuration example ofan optical transmission module according to a twelfth embodiment.

FIG. 19 is a sectional diagram illustrating a configuration example ofan optical transmission module according to a thirteenth embodiment.

FIG. 20 is a sectional diagram illustrating a configuration example ofan optical transmission module according to a fourteenth embodiment.

FIG. 21 is a sectional diagram illustrating a configuration example ofan optical transmission module according to a fifteenth embodiment.

FIG. 22 is a sectional diagram illustrating a configuration example ofan optical transmission module according to a sixteenth embodiment.

FIG. 23 is a sectional diagram illustrating a configuration example ofan optical transmission module according to a seventeenth embodiment.

FIG. 24 is a sectional diagram illustrating a configuration example ofan optical transmission module according to an eighteenth embodiment.

DETAILED DESCRIPTION

Hereinafter, preferred embodiments of the disclosure will be describedin detail with reference to drawings. Note that description will begiven in the following order.

1. First Embodiment

-   -   1.1 Configuration and Function    -   1.2 Effects    -   1.3 Modifications of First Embodiment        -   1.3.1 First Modification        -   1.3.2 Second Modification        -   1.3.3 Third Modification

2. Second Embodiment

3. Third Embodiment

4. Fourth Embodiment

5. Fifth Embodiment

6. Sixth Embodiment

-   -   6.1 First Configuration Example    -   6.2 Second Configuration Example    -   6.3 Third Configuration Example

7. Seventh Embodiment

-   -   7.1 First Configuration Example    -   7.2 Second Configuration Example

8. Eighth Embodiment

9. Ninth Embodiment

10. Tenth Embodiment

11. Eleventh Embodiment

13. Thirteenth Embodiment

14. Fourteenth Embodiment

15. Fifteenth Embodiment

16. Sixteenth Embodiment

17. Seventeenth Embodiment

18. Eighteenth Embodiment

19. Other Embodiments

1. First Embodiment (1.1 Configuration and Function)

FIG. 1 illustrates a configuration example of an optical transmissionmodule according to a first embodiment of the disclosure.

As illustrated in FIG. 1, the optical transmission module has a mainsubstrate 1, a transparent substrate (a first transparent substrate) 2,an optical element 3, a drive element 4, and an optical connector 5. Theoptical connector 5 has a synthetic resin substrate (i.e. a connectorsubstrate, hereinafter simply referred to as a resin substrate) 50. Inthe first embodiment, the optical element 3 disposed on a back surfaceside of the transparent substrate 2 is an example of a heat sourceelement. Incidentally, when the drive element 4 is disposed on the backsurface side of the transparent substrate 2 as with configurationexamples (FIG. 13 to FIG. 24) described later, the drive element 4 maybecome a heat source element.

The main substrate 1 has a front surface and a back surface. The backsurface side of the main substrate 1 is connectable to a mother board 10with a bump 80 in between. Incidentally, the main substrate 1 itself maybe the mother board 10. An end of an optical cable 51 is fixed to theresin substrate 50 by a fixing member 52. The resin substrate 50 has alens part 54 and positioning holes 53A and 53B. The main substrate 1 andthe resins substrate 50 of the optical connector 5 are oppositelydisposed and fixed by positioning pins 8A and 8B and the positioningholes 53A and 53B.

The transparent substrate 2 is disposed between the resin substrate 50and the main substrate 1. The transparent substrate 2 has an opticalfunction part such as a lens part 21 formed to face the resin substrate50. The optical element 3 is disposed between the resin substrate 50 andthe back surface of the main substrate 1, and is electrically connectedwith the main substrate 1 through a bump 81, a wiring 22, a bump (aconnection section) 82, and a wiring 11. The drive element 4 is disposedbetween the resin substrate 50 and the back surface of the mainsubstrate 1, and is electrically connected with the main substrate 1through a bump 83 and a wiring 12. Each of the bumps 80 to 83 is asolder bump. Each of the wirings 22, 11, and 12 has a function oftransferring heat that is generated by the transparent substrate 2 andthe optical element 3 as a heat source element, to the main substrate 1,in addition to a function of electrical connection.

A first special region (a connector-side special region, or a specialregion 6) to prevent the heat that is generated by the transparentsubstrate 2 and the heat source element from being transferred to theresin substrate 50 is provided between the resin substrate 50 and thetransparent substrate 2. A second special region (a body-side specialregion, or a special region 7) to provide a function of transferringheat that is generated by the transparent substrate 2 and the heatsource element is provided between the heat source element and the backsurface of the main substrate 1.

As described above, on the main substrate 1 side of the transparentsubstrate 2, the wiring 22 that electrically connects the heat sourceelement with the main substrate 1 and transfers, to the main substrate1, the heat generated from the heat source element and the transparentsubstrate 2 is provided so as to be embedded in a surface closer to themain substrate 1. The optical element 3 is mounted below the transparentsubstrate 2, as one of the heat source elements. In addition, thespecial region 7 to provide the function of transferring the heat of theheat source element to an opposite side direction of the transparentsubstrate 2 is provided on the main substrate 1 side of the heat sourceelement. On the other hand, the special region 6 is provided between thetransparent substrate 2 and the resin substrate 50 of the opticalconnector 5 on a side of the transparent substrate 2 opposite to themain substrate 1.

The transparent substrate 2 is transparent to a wavelength of light usedin optical transmission. The transparent substrate 2 may be formed ofany kinds of material that has permeability to the wavelength of anoptical signal propagating through the optical connector module, such asresin, glass, and quartz. Incidentally, a material having low thermalconductivity may be preferable in order to prevent the heat generated bythe optical element 3 from being transferred to the optical connector 5side. For example, a material having thermal conductivity lower thanthat of a wiring material (such as Al and Cu) that is formed to releasethe heat to the main substrate 1 may be preferable.

Moreover, the transparent substrate 2 is not limited to a plate shape,and may have optical function parts such as the lens part 21 and adiffraction grating. These are provided on a side opposite to the wiring22, of the transparent substrate 2. The optical function parts such asthe lens part 21 may be preferably provided so that light correctingshapes of the respective optical function parts are formed on theoptical axis same as a light emitting section of the optical element 3.In addition, when a plurality of optical functional shapes are provided,an outer size of each shape may be preferably equal to or smaller thanan arrangement pitch of the optical elements 3.

The heat source element is not limited to the optical element 3 (a lightemitting element, or a photodetector), and may be the drive element 4for the optical element 3, other functional element, or an elementincluding a plurality of these elements. The main substrate 1 may be asubstrate capable of being provided with wirings, such as an organicsubstrate, a ceramic substrate, and a flexible substrate.

A lens substrate (the resin substrate 50) of the insertable andremovable optical connector 5 is desired to have high accuracy in termsof the positioning holes (holes 53A and 53B), positional relationshipwith lens, and its shapes. For example, there is a case where variationin positional accuracy of ±10 μm or lower is demanded. On the otherhand, it is necessary to flexibly absorb slightly generated displacementof positional relationship between the positioning pins 8A and 8B andthe holes (holes 53A and 53B) without backlash. Further, to reduce itscost, preferably, an injection-moldable resin material may be employedas the material of the resin substrate 50, and the lens part 54 and theholes 53A and 53B may be formed by integral molding. As a result, it ispossible to achieve increased accuracy at a time.

When a resin is employed for the lens substrate of the optical connector5, however, thermal deformation easily occurs because thermal expansioncoefficient of the resin is high. To suppress such deformation, it isnecessary to provide the special region 6 between the transparentsubstrate 2 and the optical connector 5 to prevent the heat from beingdirectly transferred from the transparent substrate 2 to the opticalconnector 5. However, the optical connector 5 receiving the heat easilydeforms structurally due to the floating configuration. According to theconfiguration of the first embodiment, it is possible to suppress thethermal deformation of the optical connector 5 made of resin.

An optical fiber, a waveguide, and the like are used for the opticalcable 51 of the optical connector 5. These are adhered to the lenssubstrate (the resin substrate 50) through the fixing member 52.Incidentally, in the case of the waveguide, the fixing member 52 may beomitted and the waveguide may be adhered directly on the resin substrate50. Moreover, the shape of the fixing member 52 may have any of variousstructure to introduce light from the lens to the optical cable 51, suchas a vertically drawable shape, an obliquely drawable shape, a groovefixing shape, a shape sandwiching the optical cable 51 with the resinsubstrate 50, and a shape containing a reflective mirror function inbetween, without being limited to a horizontally drawable shapeillustrated in the figure. The adhesive having permeability to apropagating optical signal and having refractive index close to that ofthe optical transmission path is employed. Moreover, the adhesive mayfunction as the fixing member 52.

The lens part 54 of the resin substrate 50 of the optical connector 5 isformed of an injection resin material having permeability to thepropagating optical signal. The parts other than the lens part 54 may beformed of a material not having permeability; however, the lens part 54and the holes 53A and 53B are integrally formed because the positionalrelationship with high accuracy is necessary as described above.

The positioning pins 8A and 8B are inserted in the holes (the holes 53Aand 53B) of the optical connector 5. As the material of the positioningpins 8A and 8B, metals such as brass, copper, and aluminum may bepreferable; however, a resin material molded with high accuracy may beused. The plurality of pins 8A and 8B are disposed in the vicinity ofthe transparent substrate 2 on the main substrate 1. Four or more pins8A and 8B may be desirably located at four or more positions surroundingthe lens part 21 or the lens part 54. However, in the case where thelens is arranged in one line, the pins 8A and 8B may be located at onlytwo positions sandwiching the lens line.

The pins 8A and 8B may desirably have a step shape with flange in orderto provide the special region 6 between the transparent substrate 2 andthe resin substrate 50, and to be stably adhered to the resin substrate50 or the main substrate 1. The pins 8A and 8B are positioned and fixedto the resin substrate 50 or the main substrate 1 by solder bonding oran adhesive.

(1.2 Effects)

As described above, according to the first embodiment, since the specialregion 6 to suppress the heat transfer and the special region 7 toprovide the function of transferring the heat are formed, it is possibleto suppress deformation by the heat and deterioration of opticalcoupling efficiency. Moreover, the first embodiment may be carried outwith less and small components at low cost.

Note that effects described in the present specification are merelyexamples without limitation, and other effects may be obtained.

(1.3 Modification of First Embodiment) (1.3.1 First Modification)

FIG. 2 illustrates a configuration example of an optical transmissionmodule according to a first modification of the first embodiment. In thefirst modification, pins 9A and 9B are provided in place of the pins 8Aand 8B in the configuration of FIG. 1. The resin substrate 50 has bosses55A and 55B. Except for this point, the configuration is similar to thatof FIG. 1. As illustrated in FIG. 2, the pins 9A and 9B may penetratethe main substrate 1 from the back surface thereof through the holesopened in the main substrate 1. As illustrated in FIG. 2, for example,the bosses 55A and 55B are formed in the vicinity of the holes 53A and53B of the resin substrate 50, respectively, and the above-describedspecial region 6 is formed.

(1.3.2 Second Modification)

FIG. 3 illustrates a configuration example of an optical transmissionmodule according to a second modification of the first embodiment. Inthe second modification, bosses 56A and 56B are provided in place of thepins 9A and 9B in the configuration of FIG. 2. Except for this point,the configuration is similar to that of FIG. 2. As illustrated in FIG.3, the bosses 56A and 56B are formed on the resin substrate 50 of theoptical connector 50, and are directly inserted and fixed to the holesof the main substrate 1. In this case, the bosses 56A and 56B formed onthe optical connector 5 have two-tier structure, which forms theabove-described special region 6.

(1.3.3 Third Modification)

FIG. 4 illustrates a configuration example of an optical transmissionmodule according to a third modification of the first embodiment. Theconfiguration of the third modification is substantially similar to thatin FIG. 3; however, is provided with a wall 57. As illustrated in FIG.4, the special region 6 may be formed in such a manner that a squarebank (the wall 57) is formed around the lens part 54 of the resinsubstrate 50 of the optical connector 5. Note that in any of theconfigurations of FIG. 1 to FIG. 4, the transparent substrate 2 is notin directly contact with the resin substrate 50 of the optical connector5 in order to prevent stress from being applied to the solder couplingsection of the transparent substrate 2.

2. Second Embodiment

FIG. 5 illustrates a configuration example of an optical transmissionmodule according to a second embodiment.

Incidentally, although a configuration around the transparent substrate2 and the optical element 3 is only illustrated in FIG. 5, the otherconfigurations are substantially similar to those in FIG. 1.

As illustrated in FIG. 5, the transparent substrate 2 and the mainsubstrate 1 are bonded by a bonding section (a bump 82) using a bondingmaterial (a solder). In the special region 7, a heat conductive material23 (paste, metal, etc.) is disposed between the optical element 3 as oneof heat source elements and the main substrate 1. The heat conductivematerial 23 is closely disposed (filled) so that the total rigiditythereof is lower than that of the bonding material of the bondingsection. The heat conductive material 23 is formed so as not to be incontact with the light emitting section and a light receiving sectionthat are located on an upper surface of the optical element 3. As aresult, it is possible to more effectively transfer the heat from theheat source element to the main substrate 1, and to reduce heat emittedto the special region 6 on the optical connector 5 side.

3. Third Embodiment

FIG. 6 illustrates a configuration example of an optical transmissionmodule according to a third embodiment.

The configuration of FIG. 6 is substantially similar to that of FIG. 5;however, is provided with a metallic film 24. In the configuration ofFIG. 6, the metallic film 24 for thermal diffusion formed of, forexample, Cu is provided at a part corresponding to a lower part of theoptical element 3 that is one of the heat source elements, in the mainsubstrate 1. As a result, the heat from the heat source elementtransferred from the heat conductive material 23 is allowed to beeffectively diffused. Accordingly, it is possible to more effectivelytransfer the heat from the heat source element to the main substrate 1,and to further reduce the heat emitted to the special region 6 on theoptical connector 5 side.

4. Fourth Embodiment

FIG. 7 illustrates a configuration example of an optical transmissionmodule according to a fourth embodiment.

The configuration of FIG. 7 is substantially similar to that of FIG. 5;however, is provided with barrier metal layers 25 and 26. As illustratedin FIG. 7, when the heat conductive material 23 is a metal, the barriermetal layers 25 and 26 (for example, Ni, Pt, or the like in the casewhere the metal is a solder) to suppress the heat diffusion may bepreferably formed on a back surface of the heat source element and ametal bonding surface on a counter side to the heat source element. Inthis case, one or both of areas of the barrier metal layers 25 and 26may be preferably equal to or smaller than the area of the heat sourceelement (including the same area). For example, when the area of thebarrier metal layer 26 on the main substrate 1 side is equal to orsmaller than the size of the heat source element and a solder is used asa heat radiation metal, the solder is not spread on the solder resist onthe outside of the barrier metal layer 26. Therefore, as illustrated inFIG. 7, it is possible to suppress the solder from creeping up on theside surface of the heat source element and from diffusing into the heatsource element. The barrier metal layers 25 and 26 may be preferablyformed on both of the back surface of the heat source element and themetal bonding surface on the counter side to the heat source element;however, may be formed on only one of the surfaces. As a result, it ispossible to more effectively transfer the heat from the heat sourceelement to the main substrate 1, and to further reduce the heat emittedto the special region 6 on the optical connector 5 side.

5. Fifth Embodiment

FIG. 8 illustrates a configuration example of an optical transmissionmodule according to a fifth embodiment.

The configuration of FIG. 8 is substantially similar to that of FIG. 7;however, is provided with a low-temperature solder 23A as the heatconductive material 23. As illustrated in FIG. 8, when the heatconductive material 23 is a metal, the heat conductive material 23 maybe preferably formed of a material (the low-temperature solder 23A)whose melting point is equal to or lower than that of the other soldermaterial. In such a case, the heat radiation metal melts faster and issolidified slowly as compared with melt timing and solidification timingof the other solder bump in a reflow process. Accordingly, it ispossible to suppress the heat radiation metal from adversely affecting,in stress, self-alignment positioning of the other solder bump (thebumps 81 and 82, and the like) by a self alignment effect.

6. Sixth Embodiment

A configuration of an optical transmission module according to a sixthembodiment will be described with reference to FIG. 9 to FIG. 11.

(6.1 First Configuration Example)

FIG. 9 illustrates a first configuration example of the opticaltransmission module according to the sixth embodiment.

The configuration of FIG. 9 is substantially similar to that of FIG. 1;however, the main substrate 1 has a concave section 13, and the specialregion 7 is formed by the concave section 13. The concave section 13faces the optical element 3 that is one of the heat source elements, andis formed in a part inside the solder bump 82 of the transparentsubstrate 2. This makes it possible to ensure the larger special region7 for heat dissipation. Moreover, this makes it possible to allow theheat source element to be partially located between the front surfaceand the back surface of the main substrate 1 through the concave section13.

(6.2 Second Configuration Example)

FIG. 10 illustrates a second configuration example of the opticaltransmission module according to the sixth embodiment.

The configuration of FIG. 10 is substantially similar to that of FIG. 9;however, is further provided with a land wiring layer 14. As illustratedin FIG. 10, by forming a heat diffusion wiring layer (the land wiringlayer 14) such as a GND layer on a bottom surface of the concave section13, it is possible to more effectively transfer the heat from the heatsource element to the main substrate 1, and to reduce the heat emittedto the special region 6 on the optical connector 5 side.

(6.3 Third Configuration Example)

FIG. 11 illustrates a third configuration example of the opticaltransmission module according to the sixth embodiment.

The configuration of FIG. 11 is substantially similar to that of FIG.10; however, is further provided with a heat radiation material 27.Moreover, since the body-side special region 7 becomes larger, the heatradiation material 27 or the like as the heat conductive material 23illustrated in FIG. 5 or the like is easily filled therein, asillustrated in FIG. 11. Further, since the amount of the heat conductivematerial 23 is also increased, it is possible to further enhance heatradiation property toward the lower side of the heat source element inthe body-side special region 7.

Moreover, when the area of the concave section 13 is made larger thanthat of the heat source element, secondary effect that it is unnecessaryto polish the heat source element to be smaller than a clearancedistance between the transparent substrate 2 and the main substrate 1 isobtainable. In the optical transmission module, typically, a high speedmodulation signal of Gbps order is transmitted between the heat sourceelement mounted on the transparent substrate 2 and the main substrate 1.Therefore, the solder bump 82 (including a post section) that connectsthe heat source element and the main substrate 1 may preferably have asmall capacity, namely, the bump diameter of the bump 82 may bepreferably made small. For example, typically, the bump diameter may beequal to or smaller than Φ200 μm. However, in the case where the mainsubstrate 1 has a flat shape, it is necessary for the thickness of theheat source element to be smaller than a value that is obtained bysubtracting a sum of a bump size of the heat source element and anecessary clearance between the heat source element and the mainsubstrate 1, from at least 200 μm, in order to put the heat sourceelement in the special region 7. In such a case, for example, thethickness becomes 150 μm or lower, and the difficulty level of the thinpolishing process becomes extremely high. Accordingly, the yield of theheat source element is decreased, which results in cost increase of theheat source element. Therefore, in such a viewpoint, large effect isobtainable by formation of the concave section 13.

Furthermore, when the thin polishing is unnecessary, the heat sourceelement, in particular, a light emitting element (VCSEL: vertical cavitysurface emitting laser) receives benefit in terms of reliability. Thelight emitting element is configured by stacking a lot of reflectivefilms, and the vicinity of the light emitting section is extremelyvulnerable. The light emitting element is sensitive to external stress,and thus when the thickness of the substrate as a base is small,reliability is deteriorated due to adverse affect from slight externalstress. In this respect as well, the formation structure of the concavesection 13 allowing the thin polishing to be unnecessary is effective.

Further, an effect that the thermal capacity of the optical element 3(the heat source element) itself is increased is obtainable by the factthat the thin polishing is unnecessary. The light emitting efficiency ofthe optical element 3 is lowered and a life time thereof is shortened asoperation temperature of the light emitting section of the opticalelement 3 is increased. When the volume of the substrate of the opticalelement 3 is increased, the thermal capacity of the optical element 3itself is increased, which suppresses temperature increase, andtherefore, the optical element 3 is difficult to receive the adverseaffect.

Moreover, sealing the bump 82 of the transparent substrate 2 by a fillermakes it possible to suppress dissipation of the radiation heat from theheat source element to the connector-side special region 6. As thesecondary effect, in the case where the heat source element is theoptical element 3, it is expected to obtain dust-proof and drip-proofeffects in the optical transmission path between the optical element 3and the transparent substrate 2.

In addition, it is possible to reduce the size of the solder bump 82(including the post section) between the main substrate 1 and thetransparent substrate 2 through which the high speed modulation signalof Gbps order is transmitted, by the fact that interference iseliminated between the back surface of the heat source element and themain substrate 1 by formation of the concave section 13. As a result, aparasitic capacitance of the solder bump 82 becomes smaller, and adverseeffect such as signal reflection is allowed to be reduced. Furthermore,design of optical transmission module with higher waveform quality of ahigh speed signal becomes possible. Consequently, large effects areobtainable by formation of the concave section 13 in such a viewpoint.

7. Seventh Embodiment

A configuration of an optical transmission module according to a seventhembodiment will be described with reference to FIG. 12 and FIG. 13.

(7.1 First Configuration Example)

FIG. 12 illustrates a first configuration example of the opticaltransmission module according to the seventh embodiment.

The configuration of FIG. 12 is substantially similar to that of FIG. 9;however, is provided with a through hole 15 in place of the concavesection 13. Changing the structure of the main substrate 1 from aconcave (cavity) structure to a structure having the through hole 15 asillustrated in FIG. 12 makes it possible to ensure larger heat radiationspace of the body-side special region 7. Further, since the radiationpath for the emitted heat is provided up to the back surface side of themain substrate 1, it is possible to further suppress the heattransferred to the connector-side special region 6. Furthermore, it ispossible to dispose the heat source element partially between the frontsurface and the back surface of the main substrate 1 through the throughhole 15. This makes it easy to locate the vertical position of the heatsource at a position close to a center line of the main substrate 1. Asa result, it becomes possible to further suppress warpage of the mainsubstrate 1 associated with thermal expansion, and furthermore, itbecomes possible to suppress displacement of the positional relationshipbetween the main substrate 1 and the connector 5.

(7.2 Second Configuration Example)

FIG. 13 illustrates a second configuration example of the opticaltransmission module according to the seventh embodiment.

The configuration of FIG. 13 is substantially similar to that of FIG.12; however, the width of the through hole 15 is expanded to a positioncovering the drive element 4. In addition, bumps 84 and 85 that connectthe transparent substrate 2 with the drive element 4 are provided.Further, a bump 86 connecting the transparent substrate 2 with the mainsubstrate 1 is provided. In addition, a wiring 16 to electricallyconnect the drive element 4 with the main substrate 1 is provided. Inthe configuration of FIG. 13, the vertical position of the heat sourceis easily positioned at the center line of the main substrate 1.Accordingly, it is possible to further suppress the warpage of the mainsubstrate 1 associated with the thermal expansion. Furthermore, it ispossible to suppress displacement of the positional relationship betweenthe main substrate 1 and the optical connector 5.

8. Eighth Embodiment

FIG. 14 illustrates a configuration example of an optical transmissionmodule according to an eighth embodiment.

The configuration of FIG. 14 is substantially similar to that of FIG.13; however, is further provided with a transparent substrate 60 (asecond transparent substrate).

In the configuration of FIG. 14, the transparent substrate 60 having thesame specification as that of the transparent substrate 2 is mounted onthe back surface of the main substrate 1 provided with the through hole15. The main substrate 1 is sandwiched between the transparent substrate2 and the transparent substrate 60 that have the same specification aseach other, which makes it possible to ensure vertical structuralbalance as viewed from the main substrate 1. As a result, it is possibleto further suppress the warpage of the main substrate 1.

Moreover, a heat radiation material 63 or the like is filled between theheat source element and the transparent substrate 60 on the back surfaceside of the main substrate 1, which makes it possible to release theheat from the heat source element to the back surface side of the mainsubstrate 1. Accordingly, it is possible to further suppress the heattransferred to the connector-side special region 6.

In addition, as described above, when a filler 62 (the sealing material)seals the bump 86 of the upper transparent substrate 2 and the bump 61of the lower transparent substrate 60, it becomes possible to suppressdissipation of the radiated heat from the heat source element to theconnector-side special region 6. As the secondary effect, it is expectedto obtain dust-proof and drip-proof effects in the optical transmissionpath between the optical element 3 and the transparent substrates 2 and60.

9. Ninth Embodiment

FIG. 15 illustrates a configuration example of an optical transmissionmodule according to a ninth embodiment.

The configuration of FIG. 15 is substantially similar to that of FIG.14; however is further provided with a Cu film 64.

In the case of the configuration of FIG. 14, a heat path between theheat source element and the transparent substrate 2 on the front surfaceside is ensured through the metal bump 86 having a high thermalconductivity. On the other hand, a heat path between the heat sourceelement and the transparent substrate 60 on the back surface side isformed through the heat radiation material 63 having thermalconductivity lower than that of the metal bump 86. Therefore, heatradiation effect differs between the upper heat radiation path and thelower heat radiation path, which may cause the warpage of the mainsubstrate 1. Accordingly, as illustrated in FIG. 15, the wiring patternof the transparent substrate 60 on the back surface side may be formedof, for example, the solid Cu film 64, which makes it possible to adjustthermal conductivity to reduce non-uniformity in thermal conductivity.Furthermore, the warpage of the main substrate 1 is suppressed so thatthe displacement of the positional relationship between the mainsubstrate 1 and the optical connector 5 is suppressed.

10. Tenth Embodiment

FIG. 16 illustrates a configuration example of an optical transmissionmodule according to a tenth embodiment.

The configuration of FIG. 16 is substantially similar to that of FIG.14; however, is provided with a highly heat conductive substrate 65 suchas a Cu substrate, in place of the transparent substrate 60.

When non-uniformity of the thermal conductivity described in the ninthembodiment is large, the thermal conductivity is allowed to be balancedby changing the layer structure or the material of the transparentsubstrate 60 on the back surface side. For example, arrangement allowingthe configuration as a whole to be optimal is possible in such a mannerthat the transparent substrate 60 on the back surface side is changed tothe highly heat conductive substrate 65 such as the Cu substrate asillustrated in FIG. 16, the number of connection bumps on the backsurface substrate may be adjusted, connection of the back surfacesubstrate to the main body is performed with use of various adhesives,etc.

11. Eleventh Embodiment

FIG. 17 illustrates a configuration example of an optical transmissionmodule according to an eleventh embodiment.

The configuration of FIG. 17 is substantially similar to that of FIG.15; however, is further provided with an elastic body 28.

The case where the heat transfer is controlled by the sealing of thebump 86 has been described above (FIG. 14, and the like). Likewise, inthe special region 6 on the optical connector 5 side, it is possible toemploy a configuration in which sealing is performed between the mainsubstrate 1 and the optical connector 5 by the elastic body 28 with lowthermal conductivity and low rigidity, such as urethane, rubber, andplastic, to prevent the heat from flowing into the special region 6 fromany path other than a predetermined path. In this case, as a secondaryeffect, dust-proof and drip-proof effects between the resin substrate 50of the optical connector 5 and the transparent substrate 2 are allowedto be obtained.

12. Twelfth Embodiment

FIG. 18 illustrates a configuration example of an optical transmissionmodule according to a twelfth embodiment.

The configuration of FIG. 18 is substantially similar to that of FIG.14; however, is further provided with a heat radiation material 71, aland layer 72, a thermal via 73, and a GND layer 74 on the mother board10 side.

When the heat conductive material (a heat radiation material 71) isfilled in a space between the transparent substrate 60 on the backsurface side and the mother board 10 just blow the transparent substrate60, heat radiation effect to the lower side of the main substrate 1 isenhanced, and as a result, it is possible to suppress the heattransferred to the special region 6 on the optical connector 5 side. Inthis case, providing the Cu thermal via 73 and the Cu land (the landlayer 72) on the mother board 10 makes it possible to further enhanceheat radiation property.

13. Thirteenth Embodiment

FIG. 19 illustrates a configuration example of an optical transmissionmodule according to a thirteenth embodiment.

As illustrated in FIG. 19, as a modification of the configuration ofFIG. 18, a configuration from which the transparent substrate 60 on theback surface side is omitted may be employed.

14. Fourteenth Embodiment

FIG. 20 illustrates a configuration example of an optical transmissionmodule according to a fourteenth embodiment.

As illustrated in FIG. 20, as a modification of the configuration ofFIG. 14, a passive element 17 (such as a capacitor and a resistor) maybe mounted on the main substrate 1, and the mechanical rigidity of themain substrate 1 may be enhanced to suppress the thermal deformation ofthe main substrate 1. Furthermore, the thermal deformation of the mainsubstrate 1 is suppressed, which makes it possible to suppressdisplacement of the positional relationship between the main substrate 1and the optical connector 5.

15. Fifteenth Embodiment

FIG. 21 illustrates a configuration example of an optical transmissionmodule according to a fifteenth embodiment.

As illustrated in FIG. 21, as a modification of the configuration ofFIG. 14, a configuration in which a core material 87 having higherthermal conductivity such as Cu is sealed in the bump 86 of thetransparent substrate 2 is also effective. In this case, it is expectedto obtain an effect of enhancing the thermal conductivity as well as aneffect of suppressing inclination of the transparent substrate 2, as thesecondary effect. The same applies to all of the solder bumpsconfiguring the module, and thus the effects of the application areexpected.

16. Sixteenth Embodiment

FIG. 22 illustrates a configuration example of an optical transmissionmodule according to a sixteenth embodiment.

As illustrated in FIG. 22, as a modification of the configuration ofFIG. 14, a configuration in which a light emitting element and aphotodetector as the heat source elements are provided on one opticalaxis between the transparent substrate 2 and the transparent substrate60 may be employed.

As illustrated in FIG. 22, a configuration in which a both-sides lightemitting element 30 is applied as a light emitting element and aphotodetector 31 is mounted between the transparent substrate 60 on theback surface side and the light emitting element may be employed.Alternatively, a configuration in which a light-transmissive lightemitting element or photodetector is mounted on an upper side through ahole structure, and the photodetector 31 or light emitting element isdisposed on the transparent substrate 60 on the back surface side may beemployed. In this configuration, optical output of the light emittingelement is allowed to be monitored by the photodetector 31 at the sametime of light emission. Moreover, bidirectional optical transmission isallowed in one-channel optical transmission path. As described above,various combinations in the positional relationship between the lightemitting element and the photodetector are possible.

17. Seventeenth Embodiment

FIG. 23 illustrates a configuration example of an optical transmissionmodule according to a seventeenth embodiment.

As illustrated in FIG. 23, as a modification of the configuration ofFIG. 14, a configuration in which an electrical wiring to connect thepositioning pins 8A and 8B with a power system or a signal system isfurther provided may be employed.

The lens substrate (the resin substrate 50) of the optical connector 5is desired to have high accuracy in terms of positioning holes (theholes 53A and 53B), the positional relationship with the lens, and itsshapes. For example, there is a case where variation in positionalaccuracy of ±10 μm or lower is demanded. On the other hand, it isnecessary to flexibly absorb slightly generated displacement of thepositional relationship between the positioning pins 8A and 8B and theholes (the holes 53A and 53B) without backlash. In addition, to reduceits cost, preferably, an injection-moldable resin material may beemployed as the material of the resin substrate 50, and the lens part 54and the holes 53A and 53B may be formed by integral molding. As aresult, it is possible to achieve high accuracy at a time.

For the reason described above, an engaging state between the holes (theholes 53A and 53B) of the resin substrate 50 of the optical connector 5and the positioning pins 8A and 8B is allowed to be maintained withoutbacklash. Therefore, the positioning pins 8A and 8B may be electricallyconnected with the power system such as GND and Vcc (through a Vccwiring 18 and a GND wiring 19). Alternatively, any signal system may beconnected with the main substrate 1. When electric terminals that areconnected similarly to electric cables are provided in the holes (theholes 53A and 53B) of the optical connector 5, photoelectricalcomposition of the optical module is allowed to be achieved. Forexample, an electric terminal 91 may be provided above the hole 53A, andmay be connected to an electric cable 93. Moreover, for example, anelectric terminal 92 may be provided above the hole 53B, and may beconnected to an electric cable 94.

Alternatively, on the optical connector 5 side, a wiring that allows thepositioning holes (the holes 53A and 53B) to be electricallyshort-circuited is provided, and the optical connector 5 is engaged withthe positioning pins 8A and 8B. As a result, the positioning pins 8A and8B are electrically short-circuited, which makes it possible to monitorattachment and detachment state of the optical connector 5. For example,if an algorism circuit forcibly stopping a laser beam at the time whenfor example, the optical connector 5 is disconnected and theshort-circuit path is opened is incorporated, it is possible to providethe optical transmission module with a function corresponding to eyesafety.

18. Eighteenth Embodiment

FIG. 24 illustrates a configuration example of an optical transmissionmodule according to an eighteenth embodiment.

As illustrated in FIG. 24, as a modification of the configuration ofFIG. 14, a configuration in which a metal substrate 95 is provided inplace of the transparent substrate 60 may be employed.

Further, as illustrated in FIG. 24, it is possible to provide vias 96such as GND around the through hole 15 to enhance EMC resistance insidethe through hole 15. In this case, it is possible to further enhance theeffect by providing a Cu land layer in a space section of thetransparent substrate 2, and replacing the transparent substrate 60 onthe back surface side with a metal substrate 95.

Incidentally, in the configuration in which the main substrate 1 has thecavity section (the concave section 13) illustrated in FIG. 9 and thelike, it is possible to enhance the EMC resistance by providing the vias96 such as GND around the concave section 13.

19. Other Embodiments

The technology of the present disclosure is not limited to descriptionof the above-described embodiments, and various modifications may bemade.

For example, the present technology may be configured as follows.

(1) An optical transmission module including:

a main substrate having a front surface and a back surface;

an optical connector having a connector substrate;

a first transparent substrate disposed between the connector substrateand the main substrate;

a heat source element disposed between the connector substrate and theback surface of the main substrate, and electrically connected to themain substrate;

one or a plurality of wirings electrically connecting the heat sourceelement to the main substrate, and each configured to transfer heatgenerated from the heat source element and the first transparentsubstrate, to the main substrate;

a first special region provided between the connector substrate and thefirst transparent substrate to prevent the heat generated from the heatsource element and the first transparent substrate, from beingtransferred to the connector substrate; and

a second special region provided between the heat source element and theback surface of the main substrate to provide a function of transferringthe heat generated from the heat source element and the firsttransparent substrate.

(2) The optical transmission module according to (1), further including:

a bonding section bonding the first transparent substrate to the mainsubstrate with use of a bonding material; and

a heat conductive material disposed in the second special region, andhaving rigidity lower than rigidity of the bonding material of thebonding section.

(3) The optical transmission module according to (2), further including

a metal film for thermal diffusion provided between the heat conductivematerial and the back surface of the main substrate.

(4) The optical transmission module according to (2) or (3), furtherincluding

a barrier metal layer provided between the heat conductive material andthe heat source element or between the heat conductive material and themain substrate or barrier metal layers provided between the heatconductive material and the heat source element and between the heatconductive material and the main substrate, wherein

the heat conductive material is a metal, and

the barrier metal layers each have an area equal to or smaller than anarea of the heat source element.

(5) The optical transmission module according to any one of (2) to (4),wherein

the first transparent substrate and the main substrate are bonded toeach other with use of a solder material, and the heat source elementand the first transparent substrate are bonded to each other with use ofthe solder material as well, and

the heat conductive material is a metal having a melting point equal toor lower than a melting point of the solder material.

(6) The optical transmission module according to any one of (1) to (5),wherein

the first transparent substrate has a first optical element provided toface the connector substrate,

the heat source element is disposed between the first transparentsubstrate and the main substrate, and

the first optical element and the heat source element are disposed onone optical axis.

(7) The optical transmission module according to any one of (1) to (6),wherein

the connector substrate has a second optical element and a positioninghole, and

the second optical element, the positioning hole, and the connectorsubstrate are integrally molded with use of a injection-moldable resinmaterial.

(8) The optical transmission module according to any one of (1) to (7),wherein

the main substrate has one of a concave section and a through hole, and

one of the concave section and the through hole configures the secondspatial region.

(9) The optical transmission module according to (8), wherein part ofthe heat source element is located inside the concave section or thethrough hole.

(10) The optical transmission module according to any one of (1) to (9),further including

a solder bump connecting the first transparent substrate and the mainsubstrate, wherein

the solder bump has a diameter equal to or lower than a thickness of theheat source element.

(11) The optical transmission module according to any one of (1) to(10), wherein

an optical element and a drive element for the optical element thatconfigure the heat source element are provided.

(12) The optical transmission module according to any one of (1) to(11), further including

a heat radiation material, and one of a second transparent substrate anda highly heat conductive substrate, wherein

the heat source element and the main substrate are disposed between thefirst transparent substrate and the second transparent substrate orbetween the first transparent substrate and the highly heat conductivesubstrate, and

the heat radiation material is disposed between the heat source elementand the second transparent substrate or between the heat source elementand the highly heat conductive substrate.

(13) The optical transmission module according to (12), furtherincluding a structure allowing thermal conductivity between the firsttransparent substrate and the heat source element to be equal to thermalconductivity between the second transparent substrate and the heatsource element or between the highly heat conductive substrate and theheat source element.

(14) The optical transmission module according to (12) or (13), furtherincluding:

a first solder bump connecting the first transparent substrate with themain substrate;

a second solder bump connecting the second transparent substrate withthe main substrate; and

a sealing member that seals up the first solder bump and the secondsolder bump to suppress diffusion of the heat.

(15) The optical transmission module according to any one of (1) to(14), further including

an elastic body between the main substrate and the optical connector,the elastic body preventing heat inflow.

(16) The optical transmission module according to any one of (12) to(14), wherein a light emitting element and a photodetector are providedon one optical axis between the first transparent substrate and thesecond transparent substrate, the light emitting element and thephotodetector configure the heat source element.

(17) The optical transmission module according to any one of (1) to(16), further including:

a positioning pin connecting the main substrate with the connectorsubstrate; and

an electrical wiring connecting the positioning pin to a power system ora signal system.

(18) The optical transmission module according to (8), wherein the mainsubstrate has a via formed around the concave section or the throughhole.

(19) The optical transmission module according to any one of (1) to(18), further including

a passive element provided on the front surface of the main substrate,and configured to suppress thermal deformation of the main substrate.

(20) The optical transmission module according to any one of (1) to(19), further including

a solder bump connecting the main substrate with the first transparentsubstrate, the solder bump including a core material therein.

It should be understood by those skilled in the art that variousmodifications, combinations, sub-combinations, and alterations may occurdepending on design requirements and other factors insofar as they arewithin the scope of the appended claims or the equivalents thereof.

What is claimed is:
 1. An optical transmission module comprising: afirst substrate having a surface; a driving circuit disposed over thesurface of the first substrate; one or more wirings disposed in contactwith the first substrate; a metal layer disposed on the one or morewirings; a heat conductive material disposed on the metal layer; anoptical element having a first surface and a second surface andincluding a light emitting element, the second surface of the opticalelement disposed over the heat conductive material, the metal layer, andthe one or more wirings along a plane that is transverse to the secondsurface of the optical element, and the optical element is electricallyconnected to the driving circuit via the one or more wirings; a secondsubstrate having a first surface and a second surface; a lens disposedon the first surface of the second substrate; and a connection memberthat connects together the first surface of the second substrate and thesurface of the first substrate, wherein the first surface of the secondsubstrate is separated from the second surface of the optical element bya predetermined distance.
 2. The optical transmission module accordingto claim 1, wherein the optical element further includes a photodetector.
 3. The optical transmission module of claim 1, wherein thesecond substrate and the lens are integrally molded.
 4. The opticaltransmission module of claim 1, further comprising side walls thatsurround the optical element.
 5. The optical transmission module ofclaim 1, further comprising: a third substrate; and a second connectionmember that connects together a first surface of the third substrate andthe surface of the first substrate, wherein, in a cross-sectional view,a first width of the second connection member near the first surface ofthe first substrate is smaller than a second width of the secondconnection member near the surface of the first substrate.
 6. Theoptical transmission module of claim 5, wherein the second connectionmember is a pin.
 7. The optical transmission module of claim 5, whereinthe second connection member includes a resin and an adhesive.
 8. Theoptical transmission module according to claim 5, further comprising: anelectrical wiring connecting the second connection member to a powersystem or a signal system.
 9. The optical transmission module of claim1, wherein the predetermined distance is in a special region.
 10. Theoptical transmission module of claim 1, wherein the heat conductivematerial is a paste.
 11. The optical transmission module of claim 1,wherein the heat conductive material is a metal.
 12. The opticaltransmission module according to claim 1, wherein the heat conductivematerial has a first rigidity lower than a second rigidity of theconnection member.
 13. The optical transmission module of claim 1,wherein the metal layer is a barrier metal layer.
 14. The opticaltransmission module of claim 1, wherein the metal layer is a layer ofnickel (Ni) or a layer of platinum (Pt).
 15. The optical transmissionmodule according to claim 1, wherein the metal layer has a first areaequal to or smaller than a second area of the optical element.
 16. Theoptical transmission module according to claim 1, further comprising: afirst solder material that bonds the optical element to the secondsubstrate, wherein the connection member is a second solder material,and wherein the heat conductive material is a metal having a firstmelting point equal to or lower than a second melting point of the firstsolder material and the second solder material.
 17. The opticaltransmission module according to claim 1, wherein the connection memberis a solder bump connecting the first surface of the second substrate tothe surface of the first substrate, wherein the solder bump has adiameter equal to or lower than a thickness of the optical element. 18.The optical transmission module according to claim 17, wherein thesolder bump includes a core material.
 19. The optical transmissionmodule according to claim 1, further comprising a passive elementprovided on the surface of the first substrate, the passive elementconfigured to suppress thermal deformation of the first substrate.